Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology
نویسندگان
چکیده
By applying the etching via technology, this study proposes a novel front-side etching fabrication process for a silicon-based piezoresistive pressure sensor to replace the conventional back-side bulk micro-machining. This novel structure pressure sensor can achieve the distinguishing features of the chip size reduction and fabrication costs degradation. In order to investigate the sensor performance and the sensor packaging e s t p t p f ©
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